MECHANIC S-60 BGA IC Adhesive Remover 20ml

MECHANIC S-60 is a specialized liquid chemical designed for removing hard adhesives, resins, and underfill compounds used in BGA and IC packages. It is widely used in professional electronics repair services, especially during iPhone and mobile device repairs.

The formula is developed for safe and effective softening of bonding materials that protect sensitive components on PCB boards.

Its main function is to dissolve and remove stubborn BGA/IC adhesives, allowing safe chip removal without damaging solder pads or the PCB itself. The carefully balanced composition ensures precise and controlled rework operations.

The product comes in a convenient 20 ml bottle, ideal for professional electronics repair and rework applications.