MECHANIC XGZ40 Solder Paste Sn63Pb37 10ml for SMD BGA PCB

MECHANIC XGZ40 is a high-quality solder paste composed of flux and solder microparticles sized 20–38 microns. It is designed for precise surface soldering and repair of SMD, BGA, PGA, and PCB components.

Thanks to its high viscosity, the paste does not spread during heating, ensuring clean and accurate soldering. It provides neat solder joints with minimal flux residue. The syringe-style container allows precise spot application, making it ideal for repair and rework tasks.

This solder paste is commonly used for soldering without a traditional soldering iron. It can be applied using hot air stations, infrared heaters, hot plates, and even gas torches or lighters. It is widely used in the electronics industry for surface mounting of SMD components.

• MECHANIC XGZ40 Sn63Pb37 solder paste
• Contains 20–38 µm solder microparticles
• High viscosity – does not spread when heated
• Clean soldering with minimal flux residue
• Syringe packaging for precise application
• Suitable for soldering without a soldering iron
• Compatible with hot air, IR, hot plate, torch/lighter
• Widely used in electronics and PCB repair