MECHANIC XG-Z40 – 183°C Solder Tin Paste for PCB / BGA / SMD Repair

MECHANIC XG-Z40 is a solder tin paste designed for precision electronics repair and motherboard soldering. With a melting point of approximately 183°C, it is suitable for SMD, BGA, PCB, and other electronic repair applications.

• Solder tin paste for electronics repair.
• Model MECHANIC XG-Z40.
• Melting point approx. 183°C.
• Suitable for PCB, SMD and BGA soldering.
• Combines solder alloy powder with flux for convenient precision application.
• Good wetting performance.
• Helps provide even solder distribution across pads.
• Designed for professional electronics servicing.

• PCB motherboard soldering.
• BGA reballing.
• SMD component installation and repair.
• IC repair work.
• Smartphone, tablet and electronics repair.
• Professional GSM repair workshops.