MECHANIC UV223 is a medium-activity solder flux paste designed for professional electronics repair and service applications. It is ideal for soldering SMD components, BGA chips, PGA packages, and PCB boards. It offers high efficiency, easy application, and a no-clean formula that ensures clean and precise work without additional cleaning.

• MECHANIC UV223 medium-activity solder flux paste
• Suitable for lead and lead-free soldering
• Designed for SMD, BGA, PGA, and PCB applications
• Improves solder wetting
• Ensures even heat distribution
• Helps achieve strong and clean solder joints
• Supports PCB trace repair
• Reduces solder bridging
• No-Clean formula – no residue, no cleaning required
• Easy application due to high-viscosity paste
• Effectively removes oxides from copper, gold, and wires
• UV indicator allows application control
• Ideal for reballing and advanced electronics repair