MECHANIC SM25 Leaded Tin Solder Balls for BGA Soldering 0.6 mm - 25,000 pcs

This is a high-quality product designed for precision soldering and repairing high-density electronic devices such as mobile phones. Thanks to its excellent quality, it is ideal for the BGA reballing process and integrated circuit soldering, ensuring reliable and durable connections.

Product specifications:

• Composition: Sn63/Pb37 (63% tin, 37% lead)
• Melting point: 183°C
• Color: Silver-gray
• Diameter: 0.6 mm
• Application: BGA reballing, integrated circuit soldering
• Quantity per package: 25,000 pieces

These solder balls are characterized by uniform size and consistency, making them an ideal choice for professionals involved in precision BGA component soldering in electronic devices.