Mechanic MagTin X Pro Professional CPU Degumming and Tinning Platform

Mechanic MagTin X Pro Professional CPU Degumming and Tinning Platform

The Mechanic MagTin X Pro is an innovative, magnetic 2‑in‑1 platform designed for service technicians working with BGA and CPU chips in smartphones and tablets, including iPhone, Huawei, and Qualcomm processors. The platform facilitates both degumming (removing black adhesive from ICs) and tinning (applying solder balls to BGA pads), ensuring precise, clean, and complete solder joints without “cold solder” issues.

Magnetic Levitation and Stabilization: Built-in magnets provide strong adhesion to stabilize the IC on the platform, allowing precise positioning and holding of the chip during work. This reduces errors and minimizes the risk of motherboard damage.

Supports Multiple Models: The platform is compatible with various CPU models, including Apple A10–A18 Pro series and other BGA chips used in Android devices, making it a versatile tool for logic board servicing.

Heat-Resistant Materials: High-quality composite materials used in the platform offer excellent heat resistance (up to approx. 500 °C), are anti-corrosive and anti-static, enhancing safety and the durability of the tool during soldering.

Precise Tinning: With specially designed steel stencils, soldering is applied at exactly planned points, providing strong, complete, and shiny solder joints without “cold solder” defects.

Applications:

• Smartphone and tablet service centers

• Workshops performing phone repairs / IC soldering

Advantages:

• 2‑in‑1 platform: degumming + tinning

• Precise IC positioning and stabilization

• High resistance to heat, corrosion, and wear

• Compatible with Apple, Huawei, and Qualcomm processors