Tin balls for soldering BGA RELIFE RL- 403B 0,2 mm

Tin balls for soldering BGA RELIFE RL- 403B 0.2mm

The BGA Solder Balls Sn63/Pb37 0.2mm RELIFE RL- 403B are high-quality solder balls designed for precise soldering and repair of devices with high component density, such as mobile phones. Thanks to their excellent quality, the RELIFE RL- 403B solder balls are ideal for BGA reballing and soldering integrated circuits, ensuring reliable and durable connections.

Product Specifications:

• Model: RELIFE RL- 403B
• Composition: Sn63/Pb37 (63% tin, 37% lead)
• Melting Temperature: 183 ℃
• Quantity: 25,000 balls per bottle
• Color: Silver-gray
• Diameter: 0.2mm
• Applications: BGA reballing, soldering integrated circuits

The RELIFE RL- 403B solder balls are characterized by their consistent size and quality, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.