Tin balls for soldering BGA RELIFE RL- 403B 0,2 mm

Name: Tin balls for soldering BGA RELIFE RL- 403B 0,2 mm
SKU: 68729
Price: 18.45 PLN
Availability: OutOfStock

18,45 zł

15,00 zł net

Availability

Within 21 daysOrientacyjny czas dostawy gdy produkt zostanie zamówiony

Details

ID	68729
Weight	0.1 kg
Wrapping	Bulk
Condition	New

Product description

Tin balls for soldering BGA RELIFE RL- 403B 0.2mm

The BGA Solder Balls Sn63/Pb37 0.2mm RELIFE RL- 403B are high-quality solder balls designed for precise soldering and repair of devices with high component density, such as mobile phones. Thanks to their excellent quality, the RELIFE RL- 403B solder balls are ideal for BGA reballing and soldering integrated circuits, ensuring reliable and durable connections.

Product Specifications:

Model: RELIFE RL- 403B
Composition: Sn63/Pb37 (63% tin, 37% lead)
Melting Temperature: 183 ℃
Quantity: 25,000 balls per bottle
Color: Silver-gray
Diameter: 0.2mm
Applications: BGA reballing, soldering integrated circuits

The RELIFE RL- 403B solder balls are characterized by their consistent size and quality, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.