MECHANIC V5B45 Lead-free low-temperature solder paste (low-melting point tin) 138°C - 42g

MECHANIC V5B45 is a lead-free Sn42Bi58 low-temperature solder paste with a melting point of 138°C, designed for precision electronics soldering and repair. Its tin-bismuth alloy enables soldering at a considerably lower temperature than conventional lead-free alloys, making it particularly useful when working with heat-sensitive SMD and BGA components.

• Lead-free solder paste for professional electronics repair.
• Sn42Bi58 alloy – 42% tin and 58% bismuth.
• Low melting point of 138°C.
• Weight 42 g.
• Low-temperature soldering helps reduce thermal stress on the PCB and surrounding components.
• Alloy particle size 25–38 µm.
• No-clean formula does not require PCB washing after soldering.
• Good wetting properties and consistency for precise application to small solder pads.
• Suitable for SMD, BGA and THT soldering.
• Particularly useful for repair processes requiring a lower soldering temperature.
• Recommended storage temperature after opening: 5–10°C.

• SMD and BGA component soldering and repair.
• BGA reballing and solder pad preparation.
• Repair of components sensitive to excessive heat.
• Smartphone, tablet and laptop motherboard repair.
• Precision electronic component soldering.
• Professional mobile phone and electronics repair workshops.