MECHANIC XGSP50 Soldering paste ( liquid solder ) with a melting temperature of 183°C - 42g.

MECHANIC XGSP50 is a high-quality Sn63/Pb37 leaded solder paste designed for precision electronics soldering. Its 183°C melting point, fine alloy particles and integrated flux make it suitable for SMD, BGA and THT work, including smartphone motherboard and electronics repair.

• Sn63/Pb37 leaded solder paste containing 63% tin and 37% lead.
• Melting point 183°C.
• Net weight 42 g.
• Contains flux to support proper wetting and solder joint formation.
• No-clean formula – does not require board washing after soldering.
• Alloy particle size 25–38 µm.
• Viscosity 50 Pa·s.
• Consistency suitable for precise application to small soldering pads.
• Suitable for professional SMD, BGA and THT soldering.
• Suitable for BGA pad pre-tinning and precision electronics repair.
• Recommended storage temperature 0–10°C.

• SMD, BGA and THT component soldering.
• BGA reballing and solder pad preparation.
• Motherboard pad tinning.
• Smartphone, tablet and laptop motherboard repair.
• Precision electronic component soldering.
• Professional mobile phone and electronics repair workshops.