Soldering paste ( liquid solder ) Mechanic XGSP50 with a melting temperature of 183°C - 42g.
Details
ID | 68716 |
Weight | 0.04 kg |
Wrapping | Box |
Condition | New |
Product description
Soldering Paste (Liquid Solder) Mechanic XGSP50 42g
No Clean: No need for cleaning after soldering, enhances process efficiency.
Silver Formula: New silver-infused formula for excellent soldering performance.
Suitable for GSM and BGAP Arrays: Ideal for GSM technology and BGAP arrays, ensuring desired reproduction of solder fields on BGA circuits.
Pre-Coating BGA Pads with Lead Tin: Excellent for pre-coating BGA pads with lead-tin solder.
Easy Application and Activation: Simple application, activated by heating to 183°C.
No Cleaning Required after Soldering/Melting: No need to clean after the process is completed.
Storage at 0°C - 10°C: Maintains properties when stored at the appropriate temperature.
Resin and Solvent-Based Flux: Contains resin and solvent-based flux for effective soldering.
Specifications:
- Melting Temperature: 183°C
- Weight: 42g
- Alloy: Sn63 / Pb37
- Particle Size: 25-38 µm
- Viscosity: 50 (Pa·S)
Attributes
Weight | 0.04 kg |
Wrapping | Box |
Condition | New |
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