RELIFE RL-403B Tin balls for soldering BGA 0,55mm

Name: RELIFE RL-403B Tin balls for soldering BGA 0,55mm
SKU: 68385
Price: 18.45 PLN
Availability: InStock

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Details

ID	68385
Weight	0.1 kg
Wrapping	Bulk
Condition	New

Product description

BGA Solder Balls RELIFE RL-403B 0.55mm

BGA solder balls Sn63/Pb37 0.55mm RELIFE RL-403B are a high-quality product designed for precise soldering and repair of devices with a high component density, such as mobile phones. Thanks to their excellent quality, RELIFE RL-403B balls are ideal for BGA reballing and IC soldering, ensuring reliable and durable connections.

Product Specifications:

Model: RELIFE RL-403B
Composition: Sn63/Pb37 (63% tin, 37% lead)
Melting temperature: 183 ℃
Quantity: 25,000 balls per bottle
Color: Silver-gray
Diameter: 0.55mm
Application: BGA reballing, IC soldering

RELIFE RL-403B solder balls feature consistent size and uniformity, making them an ideal choice for professionals working on precise BGA soldering in electronic devices.