RELIFE RL-403B Tin balls for soldering BGA 0,55mm

BGA Solder Balls RELIFE RL-403B 0.55mm

BGA solder balls Sn63/Pb37 0.55mm RELIFE RL-403B are a high-quality product designed for precise soldering and repair of devices with a high component density, such as mobile phones. Thanks to their excellent quality, RELIFE RL-403B balls are ideal for BGA reballing and IC soldering, ensuring reliable and durable connections.

Product Specifications:

• Model: RELIFE RL-403B

• Composition: Sn63/Pb37 (63% tin, 37% lead)

• Melting temperature: 183 ℃

• Quantity: 25,000 balls per bottle

• Color: Silver-gray

• Diameter: 0.55mm

• Application: BGA reballing, IC soldering

RELIFE RL-403B solder balls feature consistent size and uniformity, making them an ideal choice for professionals working on precise BGA soldering in electronic devices.