Thermal conductive paste AG Copper with copper addition - 1.5ml ( 4g )

AG Copper is a non-conductive thermal paste designed for filling the space between the processor and the heatsink to improve cooling.

It is made from copper and is not suitable for use with aluminum heatsinks.

It should be stored in a well-ventilated, cool, and dry place, and when not in use, containers should be tightly closed and protected from sunlight.

Syringe capacity: 1.5ml ( 4g)

Properties:

- Fills the space between the processor and the heatsink

- Not suitable for aluminum heatsinks

- Non-conductive

- Thermal conductivity: 3.1 W/mK

- Appearance: paste, copper

- Odor: odorless

- Melting temperature: -50°C

- Density: 2.9 g/cm³

- Operating temperature range: -50 - 250°C