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Thermal conductive paste AG Copper with copper addition - 1.5ml ( 4g )

5,04 € gross
4,10 € net
Availability
Within 7 daysOrientacyjny czas dostawy gdy zostanie złożone zapotrzebowanie

Details
ID67300
Weight0.003 kg
WrappingBulk
ConditionNew

Product description

AG Copper is a non-conductive thermal paste designed for filling the space between the processor and the heatsink to improve cooling.

It is made from copper and is not suitable for use with aluminum heatsinks.

It should be stored in a well-ventilated, cool, and dry place, and when not in use, containers should be tightly closed and protected from sunlight.

Syringe capacity: 1.5ml ( 4g)

Properties:

- Fills the space between the processor and the heatsink

- Not suitable for aluminum heatsinks

- Non-conductive

- Thermal conductivity: 3.1 W/mK

- Appearance: paste, copper

- Odor: odorless

- Melting temperature: -50°C

- Ignition temperature: 350°C

- Density: 2.9 g/cm³

- Operating temperature range: -50 ~ 250°C

Attributes

Weight0.003 kg
WrappingBulk
ConditionNew
5,04 € gross
4,10 € net
Availability
Within 7 daysOrientacyjny czas dostawy gdy zostanie złożone zapotrzebowanie

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