AG Gold thermal paste - 3g

AG Gold is a thermal paste with the addition of gold.

It is characterized by exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. It allows you to lower the processor temperature (to about 6°C) without having to replace the heatsink, which is especially useful for people who decide to overclock. AG Gold paste can be placed on the CPU, GPU, RAM module or other component.

3g paste in a syringe.

Properties

• Gold-colored thermal paste
• Thermal conductivity: > 2.8 W/m2
• Thermal impedance: < 0.095°C in2/W
• Specific gravity: > 2.5 g/cm3
• Evaporation: < 0.001
• Leakage: < 0.05
• Dielectric constant: > 5.1
• Operating temperature: -30~300°C
• Thermal resistance: -50~340°C
• Packaging: syringe
• Weight: 3 g