Low-temperature solder paste (low-melting tin) 138℃ RELIFE RL-404S 10CC + needle

RELIFE RL-404S paste is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes. Thanks to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. replacing the CPU in the iPhone) without exposing other phone components to damage.

The kit includes:

• Relife RL-404S solder paste - 1 piece,
• dosing needle - 3 pieces,
• syringe plunger - 1 piece.

Specification :

•manufacturer: RELIFE

• model: RL-404S

• composition: Sn42 / Bi58 (42% tin, 58% bismuth)

• type: lead free (Lead Free)

• melting point: 138°C

• particle size: 20-38um

•volume: 10 cm³

•paste color after spreading: light grey

• flux content: 9% +/- 0.5

•viscosity: 178 Pa.s +/-10 at 25°C

• store: at 0 - 10°C

• environmentally friendly