Tin balls for soldering BGA 0.76mm
27,06 zł
22,00 zł netProduct is available
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Details
| ID | 65218 |
| Weight | 0.55 kg |
| Wrapping | Bulk |
| Condition | New |
Product description
0.76mm Tin Solder Balls for BGA Soldering
These high-quality solder balls are designed for precise soldering and repair of devices with a high component density, such as mobile phones. Due to their excellent quality, they are ideal for the BGA reballing process and soldering integrated circuits, ensuring reliable and durable connections.
Product Specifications:
- Composition: Sn63/Pb37 (63% tin, 37% lead)
- Melting Temperature: 183 ℃
- Color: Silver-gray
- Diameter: 0.76mm
- Applications: BGA reballing, soldering integrated circuits
The solder balls are characterized by their proper size and consistency, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.
Attributes
| Weight | 0.55 kg |
| Wrapping | Bulk |
| Condition | New |
27,06 zł
22,00 zł netProduct is available
Cheaper when you buy 5 pieces!
See more
Free shipping from 500,00 zł
See more
Shipping in the next business day
See more
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