Tin balls for soldering BGA 0,3mm

Name: Tin balls for soldering BGA 0,3mm
SKU: 65217
Price: 18.45 PLN
Availability: InStock

18,45 zł

15,00 zł net

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Details

ID	65217
Weight	0.1 kg
Wrapping	Bulk
Condition	New

Product description

Tin balls for soldering BGA 0.3mm

The BGA Solder Balls Sn63/Pb37 0.3mm BST-505 are high-quality solder balls designed for precise soldering and repair of devices with high component density, such as mobile phones. Thanks to their excellent quality, the BST-505 solder balls are ideal for BGA reballing and soldering integrated circuits, ensuring reliable and durable connections.

Product Specifications:

Model: BST-505
Composition: Sn63/Pb37 (63% tin, 37% lead)
Melting Temperature: 183 ℃
Quantity: 25,000 balls per bottle
Color: Silver-gray
Diameter: 0.3mm
Applications: BGA reballing, soldering integrated circuits

The BST-505 solder balls are characterized by their consistent size and quality, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.