Tin balls for soldering BGA 0,3mm

Name: Tin balls for soldering BGA 0,3mm
SKU: 65217
Price: 24.6 PLN
Availability: InStock

24,60 zł gross

20,00 zł net

Product is available

Cheaper when you buy 5 pieces!

Free shipping from 500,00 zł

Shipping in the next business day

Details

ID	65217
Weight	0.1 kg
Wrapping	Bulk
Condition	New

Product description

Tin balls for soldering BGA 0.3mm

The BGA Solder Balls Sn63/Pb37 0.3mm BST-505 are high-quality solder balls designed for precise soldering and repair of devices with high component density, such as mobile phones. Thanks to their excellent quality, the BST-505 solder balls are ideal for BGA reballing and soldering integrated circuits, ensuring reliable and durable connections.

Product Specifications:

Model: BST-505
Composition: Sn63/Pb37 (63% tin, 37% lead)
Melting Temperature: 183 ℃
Quantity: 25,000 balls per bottle
Color: Silver-gray
Diameter: 0.3mm
Applications: BGA reballing, soldering integrated circuits

The BST-505 solder balls are characterized by their consistent size and quality, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.