Low-temperature solder paste (low-melting tin) 138°C RELIFE RL-404 - 40g

RELIFE RL-404 solder paste is a special type of low-melting solder paste (tin in the form of a paste) intended for soldering electronic components, i.e. SMD, BGA, e.g. in repair processes.

Thanks to the very low melting point of exactly 138 ° C, the use of the paste in this process allows you to perform complex repairs (e.g. replacing the CPU in the iPhone) without exposing other phone components to damage.