Flux Paste for BGA SMD AIM NC254 5g

AIM NC-254 5 g is a premium no-clean flux paste designed for precise soldering tasks, particularly in SMD and BGA applications. It offers excellent wetting and thermal stability, with no cleaning required after soldering.

• Weight: 5 g – perfect for detailed repair and assembly

• No-Clean formula – leaves minimal residue, cleaning not needed

• Excellent wetting and adhesion properties

• Improves joint reliability and reduces solder bridges

• Ideal for BGA reballing, SMD soldering, PCB repairs

• Works with both leaded and lead-free solder

• BGA rework and reballing

• SMD component assembly and repair

• PCB soldering in GSM, IT, and consumer electronics

• Service stations, repair workshops, prototyping