FLUX SMD PASTE BGA AMTECH NC-559-ASM-UV 10g

Amtech NC‑559‑ASM‑UV 10 g is a premium no‑clean UV‑activated flux paste designed for precision soldering applications in SMD, BGA, and reballing. It delivers excellent wetting, thermal stability, and clean solder joints with minimal post-reflow cleaning required.

• Weight: 10 g – suitable quantity for repair and service tasks

• No‑Clean UV formula – minimal residues, UV-curable for clean results

• Exceptional wetting – promotes smooth solder flow and strong joints

• Reduces solder bridges and improves process consistency

• Thermally stable – designed for lead-free soldering

• Compatible with reflow ovens, hot-air soldering, and hot-bar systems

• BGA reflow and reballing

• SMD component placement (QFP, QFN, BGA, CSP)

• Precision electronic repair and assembly

• Ideal for GSM/phone board repair, consumer electronics, and industrial optics servicing