Repair template for IC BGA IPhone 11 / 11 Pro / 11 Pro Max RELIFE RL-044 IPZ6

BGA Reballing Stencil / Sieve RELIFE RL-044 IPZ6

The RELIFE RL-044 IPZ6 stencil is designed for repairing BGA ICs in iPhone 11 series models.

This stencil is precisely designed for repairing BGA components on the printed circuit board.

It is made of high-quality stainless steel, with a thickness of 0.12mm, characterized by good resistance to high temperatures and deformation, ensuring even heating of each soldering point while allowing for accurate and reliable work.

The RELIFE RL-044 IPZ6 stencil is an essential tool for professional service and repair of electronics in iPhone 11 series mobile phones.