Soldering paste (liquid solder) Mechanic XGSP30 with a melting temperature of 183°C - 20g.

Soldering Paste (Liquid Solder) Mechanic XGSP30 20g

No Clean: No need for cleaning after soldering, enhances process efficiency.

Silver Formula: New silver-infused formula for excellent soldering performance.

Suitable for GSM and BGAP Arrays: Ideal for GSM technology and BGAP arrays, ensuring desired reproduction of solder fields on BGA circuits.

Pre-Coating BGA Pads with Lead Tin: Excellent for pre-coating BGA pads with lead-tin solder.

Easy Application and Activation: Simple application, activated by heating to 183°C.

No Cleaning Required after Soldering/Melting: No need to clean after the process is completed.

Storage at 0°C - 10°C: Maintains properties when stored at the appropriate temperature.

Resin and Solvent-Based Flux: Contains resin and solvent-based flux for effective soldering.

Specifications:

• Melting Temperature: 183°C
• Weight: 20g
• Alloy: Sn63 / Pb37
• Particle Size: 25-38 µm
• Viscosity: 50 (Pa·S)