Solder Paste BGA IC SP-50 50g

Name

SUNSHINE 158 ℃ BGA CPU Solder Paste

Diameter

28mm

Weight

50g

Particle size

20-38um

Conductivity rate

14

flux content

9+-0.5

Viscosity

178+-10

Feature

low smoke,RoHs solder paste,non-corroding

Melting point

158 degree

Application

Mobile CPU