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Soldering paste (liquid solder) Mechanic XG-30 with a melting temperature of 183°C - 16g

4,24 € gross
3,45 € net
Availability
Within 21 daysOrientacyjny czas dostawy gdy produkt zostanie zamówiony

Details
ID67970
Weight0.02 kg
WrappingBulk
ConditionNew

Product description

Soldering Paste (Liquid Solder) Mechanic XG-30 16g

No Clean: No need for cleaning after soldering, enhances process efficiency.

Silver Formula: New silver-infused formula for excellent soldering performance.

Suitable for GSM and BGAP Arrays: Ideal for GSM technology and BGAP arrays, ensuring desired reproduction of solder fields on BGA circuits.

Pre-Coating BGA Pads with Lead Tin: Excellent for pre-coating BGA pads with lead-tin solder.

Easy Application and Activation: Simple application, activated by heating to 183°C.

No Cleaning Required after Soldering/Melting: No need to clean after the process is completed.

Storage at 0°C - 10°C: Maintains properties when stored at the appropriate temperature.

Resin and Solvent-Based Flux: Contains resin and solvent-based flux for effective soldering.


Specifications:

  • Melting Temperature: 183°C
  • Weight: 16g
  • Alloy: Sn63 / Pb37
  • Particle Size: 25-38 µm
  • Viscosity: 50 (Pa·S)

Attributes

Weight0.02 kg
WrappingBulk
ConditionNew
4,24 € gross
3,45 € net
Availability
Within 21 daysOrientacyjny czas dostawy gdy produkt zostanie zamówiony

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